High thermal conductivity substrate / aluminum base substrate / copper base substrate
We provide metal base substrates that achieve high current and high heat dissipation.
- This is a substrate that can protect components from thermal destruction with high thermal conductivity and heat dissipation characteristics. (Base material nominal heat dissipation characteristic: 3.0 W/m·K or higher) - It offers high tracking resistance, ensuring electrical fire safety. (CTI value: 600 V or higher) - This substrate has high dielectric strength, allowing for safe use. (Through thickness dielectric strength: 3.0 kV / 100 μm) - UL certified.
- Company：シライ電子工業
- Price：Other
